Hanmi Samsung Deal
Hanmi Semiconductor Wins Major Samsung Contract for AI Substrate Equipment
Anonymous
Key Points
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The 24.48 billion won contract represents 4.24% of Hanmi Semiconductor’s 2025 consolidated sales.
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Hanmi Chairman Kwak Dong-sin publicly welcomed the customer with the statement, “Hanmi Semiconductor welcomes Samsung Group.”
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Hanmi says its MSVP system holds the No. 1 position in the global market. The company is also broadening its equipment portfolio with HBM thermocompression bonders, 2.5D packaging equipment and EMI-shielding equipment.
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The contract has no deposit or advance payment, and the final delivery date can be adjusted by mutual agreement.
Hanmi Semiconductor has won a ₩24.48 billion ($18.2 million) contract from Samsung Electro-Mechanics to supply AI semiconductor substrate production equipment, marking a significant renewal of business ties with Samsung Group after more than a decade of separation. BigGo Finance reports the deal runs through December 2027 and represents 4.24% of Hanmi's 2025 consolidated sales.
The equipment combines precision cutting, inspection, and sorting functions for AI substrates, memory chips, and other semiconductor materials. Hanmi developed its own Micro Saw technology internally, allowing it to compete globally and supply both cutting and inspection capabilities in one system.
What Hanmi Will Supply to Samsung
The order covers large-area Micro Saw & Vision Placement (MSVP) equipment designed for Samsung Electro-Mechanics' AI substrate production line. TipRanks explains the system performs precision package cutting, visual inspection, sorting, and handling all in one integrated solution. The equipment can handle AI substrates, memory chips, system semiconductors, circuit boards, and glass substrates.
Hanmi Chairman Kwak Dong-sin stated the company "welcomes Samsung Group," signaling excitement over the partnership. The contract includes no deposit or advance payment, and delivery dates can be adjusted by mutual agreement between the two companies.
A Comeback After More Than Decade Apart
This order marks a notable reconnection. Samsung Group and Hanmi had largely stopped working together following a patent dispute more than ten years ago. The new contract signals both companies are moving past that conflict to pursue mutual business opportunities in the booming AI chip sector.
The timing aligns with explosive global demand for AI infrastructure. Samsung Electro-Mechanics has also recently secured separate large orders—including a $210 million contract for multilayer ceramic capacitors for AI servers—showing the company's push deeper into AI supply chains.
Hanmi's Push Beyond Micro Saw Technology
Hanmi claims its MSVP system holds the No. 1 position globally in its category. The company previously relied on Japanese equipment suppliers but developed its own Micro Saw technology in-house, reducing dependence on imports. This internal capability lets Hanmi offer both cutting and inspection functions without partnering with external vendors.
Beyond Micro Saw, Hanmi is broadening its equipment portfolio with HBM thermocompression bonders, 2.5D packaging equipment, and EMI-shielding solutions. These additions position the company to serve more stages of advanced semiconductor manufacturing as demand for AI chips continues climbing.
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