Next-Gen Power Density
onsemi unveils a groundbreaking power platform promising significantly higher density for AI and EVs.
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onsemi CEO Hassane El-Khoury said EPP changes the traditional relationship between chip and package by making “the silicon itself part of the system architecture,” combining semiconductor technologies, manufacturing and system-level optimization in a platform intended to evolve with future innovations.
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The platform turns the package from passive housing into an active contributor to system performance. Its wafer-level architecture can embed and interconnect multiple devices—including FETs, drivers and controllers—in one package co-optimized for electrical, thermal and mechanical performance.
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onsemi said EPP is made by forming a cavity in a silicon wafer and placing the die inside it, allowing silicon, silicon carbide and vertical gallium nitride devices to be interconnected within the same architecture.
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Subaru’s engagement is also intended to provide onsemi with practical customer feedback to guide EPP’s continued development, while Subaru examines broader system-level changes in vehicle power architecture, efficiency and design flexibility.
onsemi has unveiled its Embedded Power Platform (EPP), a new chip-packaging technology that bundles silicon, silicon carbide, and gallium nitride devices into a single, hyper-efficient unit. The architecture could deliver three to five times greater power density than existing solutions, according to Yahoo Finance, addressing skyrocketing demand from data centers, electric vehicles, and AI systems.
An early prototype of a solid-state circuit breaker built on EPP was roughly 50% smaller and 20% cooler than conventional designs. Subaru has already begun evaluating the platform for future electric-vehicle designs, receiving samples and technical support to test its potential in next-generation vehicle power systems.
The Package Becomes Part of the System
onsemi's innovation flips traditional chip design on its head. CEO Hassane El-Khoury explained that EPP makes "the silicon itself part of the system architecture." Instead of a passive plastic case, the package becomes an active player in performance. Engineers etch a cavity into a silicon wafer, insert the die inside, and interconnect multiple devices—transistors, drivers, controllers—all co-optimized together, according to Simply Wall ST.
This wafer-level approach allows electrical, thermal, and mechanical performance to be tuned as one system rather than separately. The result: more compact, cooler designs that pack more power into less space—critical as data-center racks demand explosive growth in power delivery.
Data Centers Will Need 17x More Power by 2030
onsemi projects that data-center rack power demand will explode from roughly 60 kilowatts today to 200 kilowatts within two years. By the end of the decade, that figure could spike to 1 megawatt per rack—a roughly 17-fold increase. Current cooling and power-delivery systems simply cannot handle that magnitude of change without radical redesign, according to Yahoo Finance.
EPP's compact, high-efficiency design directly addresses this crisis. Smaller packages mean less heat dissipation overhead and denser server layouts. The technology is particularly well-suited for AI infrastructure, where power-hungry chips are crammed into tight spaces and heat becomes the limiting factor.
Subaru Tests the Platform for Electric-Vehicle Power
Subaru's evaluation of EPP marks a critical industry vote of confidence. The automaker is examining how the platform could reshape vehicle power architecture—everything from battery-to-motor efficiency to thermal management in compact electric drivetrains. Subaru received simulation models and technical support alongside hardware samples, according to Yahoo Finance.
This partnership also gives onsemi real-world feedback from a major automaker. Subaru's engineers can identify gaps and push improvements before EPP becomes a standard component in production vehicles. For onsemi, this early collaboration secures a potential design win in the multi-trillion-dollar electrification wave.
A $213 Billion Market Opportunity Awaits
onsemi sees power management as the defining technology layer of the next decade. The company has outlined a long-term strategy targeting a $213 billion market opportunity, where power becomes the foundational technology across infrastructure, vehicles, and physical systems, according to RiauOne.
EPP positions onsemi at the center of this shift. As AI, electrification, and autonomous systems demand higher power densities, the company's platform could become the standard architecture that enables the next generation of innovation. Early wins with Subaru and data-center customers will be key to scaling production and capturing market share.
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